Grinding Technology Japan 2025, a three-day exhibition held from March 5 to 7, 2025, at the Makuhari Messe in Chiba, Japan, is a specialized event for technicians, engineers, and grinding processing researchers. This exhibition focuses on grinding technology and tool manufacturing techniques, aiming to provide answers to technical questions on-site. The exhibition has grown significantly since its first edition in 2019 and is now in its fourth year. It is known for its strong professional awareness and the presence of high-performance equipment and tools.

The event attracts numerous buyers with significant procurement needs, leading to on-site transactions. Grinding technology is a precise and high-quality processing technique that requires advanced equipment and skilled operators. Therefore, it involves unique high-level grinding technology expertise. Automation and unmanned operations are making significant progress in the grinding field. However, proprietary techniques remain crucial.

In addition to showcasing the latest information on grinding and tool manufacturing technologies, GTJ 2025 also provides insights into skills and knowledge. The exhibition aims to prepare the best answers for visitors with technical questions based on the latest technologies and knowledge.

A new exhibition called SiC,GaN Processing Technology Show will be held concurrently with GTJ 2025. This event targets engineers, technicians, and researchers involved in advanced power semiconductor wafer processing using SiC (silicon carbide) and GaN (gallium nitride). These materials are essential for advancing power electronics technology to support electric vehicles (EVs) and renewable energy sources by 2050.

The need for large-scale production at lower costs of advanced power semiconductor wafers is urgent due to their hardness and resistance to heat and chemical corrosion. Therefore, reducing high processing costs is a priority. The SiC,GaN Processing Technology Show aims to facilitate knowledge exchange among engineers, technicians, and researchers involved in these advanced semiconductor wafer processing technologies.

Visitors can expect demonstrations of slicing (cutting), grinding, polishing, and CMP (chemical mechanical polishing) processing technologies related to advanced power semiconductor wafers at this exhibition.