SPIE Advanced Lithography + Patterning, a significant event in the semiconductor industry, is scheduled to take place from February 22 to 26, 2026, in San Jose, California. This event is dedicated to emerging technology and will feature presentations on optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications.

Notable speakers from around the globe will participate in this symposium. These include Christophe Fouquet from ASML (The Netherlands), Subramanian (Subu) Iyer from the University of California, Los Angeles (UCLA), Heike Riel from IBM Research Frontiers Institute (Switzerland), and Michael Wu from Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

The event will offer a comprehensive program with plenary talks, technical presentations, networking sessions, and course offerings. Attendees can build their personalized schedules using the SPIE Conference App to ensure they make the most of their time onsite.

The exhibition at Advanced Lithography + Patterning will provide a platform for collaboration and business transactions. Exhibitors will showcase a range of technology solutions, including photoresist, EUV materials, e-beam lithography systems, precision cleaning materials, wafer treatments, and substrates.

For those interested in career opportunities in the semiconductor lithography field, there are also chances to apply for full funding to attend the event in February. Additionally, attendees can stay connected by signing up for emails or downloading the conference app.

This symposium aims to bring together leading researchers to discuss challenges and breakthroughs in optical and EUV lithography. The event promises to be an incredible experience for all participants involved in the semiconductor industry.