The "Packaging. Depot" is a significant trade fair for packaging solutions and related technologies, held annually at the International Exhibition Centre (IEC) MoldExpo in Chisinau, the capital of the Republic of Moldova. The IEC MoldExpo is the largest exhibition center in the country and offers modern facilities and infrastructure for national and international exhibitions. The fair is organized by IEC MoldExpo, which specializes in the presentation of trade fairs and events from various economic sectors and significantly contributes to promoting trade and economy in the country. Since its inception, the "Packaging. Depot" has developed into one of the most important events in the industry in the region. The trade fair sectors include products and services from the areas of packaging materials, packaging machines, labeling, logistics, storage, warehousing services, recycling, disposal, and equipment for the design of packaging products. The main focuses of the fair are innovations, sustainability, and environmental protection, which are highlighted through the presentation of new technologies and materials. Highlights include topic-specific lectures, workshops, and networking events that promote the exchange of knowledge and experience between industry experts, manufacturers, and visitors. The "Packaging. Depot" also presents award-winning packaging designs and forward-looking technologies. In summary, the "Packaging. Depot" is an indispensable event for trade visitors and companies in the packaging industry who want to learn about the latest trends and developments, build business relationships, and expand their own network. The Packaging. Depot will take place on 4 days from Thursday, 15. May to Sunday, 18. May 2025 in Chişinău.