The NEPCON Japan, established in 1987 and held annually in January in Tokyo, is a pivotal exhibition event. Organized by RX Japan Ltd., it has evolved into an essential gathering for professionals in electronics manufacturing, research, and development over the years. NEPCON Japan is divided into seven specialized exhibitions, each covering a key aspect of the electronics industry. These include ELECTROTEST JAPAN, a fair for electronic testing and measuring equipment; IC & SENSOR PACKAGING EXPO, focusing on packaging solutions for integrated circuits and sensors; and the Electronic Components & Materials Expo, showcasing a variety of electronic components and materials. The PWB Expo specializes in the production of printed circuit boards, while the FINE PROCESS TECHNOLOGY EXPO presents innovative processing technologies. The Power Device and Module Expo focuses on power electronics and modules. INTERNEPCON JAPAN completes the lineup, featuring the latest developments in electronic production technology. A particular highlight of NEPCON Japan is its location the Tokyo Big Sight, an iconic exhibition and conference center in Tokyo. Known for its unique architecture, it offers a modern and spacious setting ideal for exhibitions and networking events. The fair is not just a showcase for products and services, but also a platform for knowledge exchange and innovation. With its wide range of topics and focal points, it provides visitors insights into the latest trends and developments in the electronics industry. From advanced manufacturing technologies to the newest research findings, NEPCON Japan remains an indispensable event for anyone active in the electronics industry. The NEPCON Japan takes place for the 40th time on 3 days from Wed., 21.01.2026 to Fri., 23.01.2026 in Tokyo.