The bonding is a renowned career fair that takes place in the old canteen at the Technical University of Dresden. It is organized by the student initiative bonding Studenteninitiative e.V. and is primarily aimed at students and graduates of engineering, natural sciences, and economics. The fair offers a platform for companies and university graduates to exchange information about career opportunities, internships, theses, and direct entry. Exhibitors present themselves at the fair to get to know potential employees and provide information about their products, services, and current vacancies. Students have the opportunity to talk to company representatives in person and find out about entry opportunities, requirements, and corporate culture. The fair is an excellent opportunity for students and graduates to learn about the job market, make valuable contacts, and lay the foundation for a successful career. The bonding will take place on 3 days from Tuesday, 06. May to Thursday, 08. May 2025 in Dresden.